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ESD11B
Transient Voltage
Suppressors
Micro ? Packaged Diodes for ESD Protection
The ESD11B Series is designed to protect voltage sensitive
XXXX
YYY
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
Specification Features
? Low Capacitance 12 pF
? Low Clamping Voltage
? Small Body Outline Dimensions: 0.60 mm x 0.30 mm
? Low Body Height: 0.3 mm
? Stand ? off Voltage: 5.0 V
? Low Leakage
? Response Time is < 1 ns
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? IEC61000 ? 4 ? 4 Level 4 EFT Protection
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
http://onsemi.com
MARKING
DIAGRAM
PIN 1
DSN2
CASE 152AA
XXXX = Specific Device Code
YYY = Year Code
ORDERING INFORMATION
Device Package Shipping ?
ESD11B5.0ST5G DSN2 5000/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Rating
IEC 61000 ? 4 ? 2 (ESD)
Contact
Air
Symbol
Value
± 15
± 15
Unit
kV
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Thermal Resistance, Junction ? to ? Ambient
Junction and Storage Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
Peak Pulse Current, 8 x 20 m s double
exponential waveform (Figure 5)
° P D °
R q JA
T J , T stg
T L
I pp
250
400
? 40 to +125
260
2.0
mW
° C/W
° C
° C
A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2013
July, 2013 ? Rev. 6
1
Publication Order Number:
ESD11B/D
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